Structures and properties of thermally conductive thermoplastic composites

Formulate thermoplastic composites that offer high thermal conductivity and good electrical insulating properties for electronic packaging purposes. Examine other important properties such as rheological properties (ease of processing) and the mechanical properties (end use performance).

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Bibliographic Details
Main Author: Ng, Hsiao Yen.
Other Authors: Lu Xuehong.
Format: Theses and Dissertations
Language:English
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/10356/5095
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Institution: Nanyang Technological University
Language: English