Structures and properties of thermally conductive thermoplastic composites
Formulate thermoplastic composites that offer high thermal conductivity and good electrical insulating properties for electronic packaging purposes. Examine other important properties such as rheological properties (ease of processing) and the mechanical properties (end use performance).
Saved in:
| 主要作者: | |
|---|---|
| 其他作者: | |
| 格式: | Theses and Dissertations |
| 語言: | English |
| 出版: |
2008
|
| 主題: | |
| 在線閱讀: | http://hdl.handle.net/10356/5095 |
| 標簽: |
添加標簽
沒有標簽, 成為第一個標記此記錄!
|