Composites for microelectronics applications

In order to improve the thermal properties of polymer at lower filler content, polystyrene (PS) composites filled with aluminum nitride (A1N) have been prepared. The most notable feature of the present work is that a special dispersion state of the filler in the composite has been formed — aluminum...

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Bibliographic Details
Main Author: Yu, Suzhu.
Other Authors: Hing, Peter
Format: Theses and Dissertations
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/10356/5137
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Institution: Nanyang Technological University