Indentation creep study on metal composite solder with different particle size

• المؤلف الرئيسي: Liu, Ye.
• مؤلفون آخرون: Chen Zhong
• التنسيق: Final Year Project
• اللغة: English
• منشور في: 2013
• الموضوعات: DRNTU::Engineering::Materials::Metallic materials::Alloys
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/52094
• المؤسسة: Nanyang Technological University

To enhance the creep resistance of eutectic Sn-58Bi solder alloy, low concentration of copper fillers with two sizes, i.e. 3μm and 45μm, have been added into alloys respectively. Their elastic modulus, hardness and creep stress exponent were characterized by using nanoindentation constant strain rat...