Interfacial fracture mechanics study of glass frit under extreme environment
High reliability equipments are essential, especially in extreme environments. Extreme environment would comprise of places with high temperature and vibration and are usually associated with down-hole activities in energy wells. Temperature is estimated to increase 25°C per kilometer deeper. Glass...
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| Format: | Final Year Project |
| Language: | English |
| Published: |
2013
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| Online Access: | http://hdl.handle.net/10356/52553 |
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| Institution: | Nanyang Technological University |
| Language: | English |
| Summary: | High reliability equipments are essential, especially in extreme environments. Extreme environment would comprise of places with high temperature and vibration and are usually associated with down-hole activities in energy wells. Temperature is estimated to increase 25°C per kilometer deeper. Glass frit bonding on ceramic substrates is ideal as a wafer level encapsulation and packaging method in these conditions. It can be used to protect integrated circuits (ICs) by providing strong and hermetic bonds under higher temperature conditions.
In this project, ceramics substrates were bonded using Asahi Glass Co. (AGC), 4115DS-1HAP7020A glass frit before undergoing thermal aging at 350°C and 400°C for up to 500 hours. Die shear testing showed that the bond strength remained above the MIL-STD-883G method 2019.5 specification of 7.9MPa throughout. Bond strength for 350°C thermal aging showed minimal changes throughout while a decreasing trend was seen in that of 400°C. Using scanning electron microscopy, differential scanning calorimetry and thermogravimetric analysis, characterization and analysis of their fractured surfaces was also carried out. |
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