Parametric studies and design of cushion packaging buffers for drop impact

• المؤلف الرئيسي: Mohamed Isa Thameem Ansari.
• مؤلفون آخرون: Lye, Sun Woh
• التنسيق: Theses and Dissertations
• منشور في: 2008
• الموضوعات: DRNTU::Engineering::Manufacturing::Product engineering
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/5257
• المؤسسة: Nanyang Technological University

In this project, a finite element modeling procedure for performing a virtual product-package drop test is successfully established. The drop test simulation using FEA is done using ANSYS/LS-DYNA. An improved cushion design procedure has been proposed.