Stress investigation on interacting defects in piezoelectric materials

Dislocation emission mechanisms for micro crack initiation are proposed, at the tips of a semi-infinite rigid conducting line for plane case and a finite rigid conducting line for plane and antiplane cases in a piezoelectric medium. The crack is simulated by distributed piezoelectric screw/edge disl...

Full description

Saved in:
Bibliographic Details
Main Author: Zhang, Hongxia
Other Authors: Xiao Zhongmin
Format: Theses and Dissertations
Published: 2008
Subjects:
Online Access:https://hdl.handle.net/10356/5287
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: Nanyang Technological University
Description
Summary:Dislocation emission mechanisms for micro crack initiation are proposed, at the tips of a semi-infinite rigid conducting line for plane case and a finite rigid conducting line for plane and antiplane cases in a piezoelectric medium. The crack is simulated by distributed piezoelectric screw/edge dislocations for antiplane/plane cases. By evaluating mechanical strain energy release rates, connections are obtained between critical rigid line extension forces and critical crack extension forces in the same solid. Two critical crack lengths are observed. Furthermore, the electroelastic interactions are investigated of a screw/edge dislocation and collinear interfacial rigid conducting/dielectric lines in a piezoelectric bimaterial, by using complex variable methods and Stroh formalism. The solutions of the field variables and all kinds of singularities at rigid line tips are obtained. Rigid line extension forces and the image force on the dislocation are calculated. Numerical examples are performed to analyze some important parameters on rigid line extension forces and image forces.