Wafer-level fine pitch Cu-Cu bonding for 3-D stacking of integrated circuits

• Main Author: Peng, Lan
• Other Authors: Lo Guo-Qiang, Patrick
• Format: Theses and Dissertations
• Language: English
• Published: 2013
• Subjects: DRNTU::Engineering::Electrical and electronic engineering
• Online Access: https://hdl.handle.net/10356/53452
• Institution: Nanyang Technological University

The increasing demand for system performance enhancement and more functionality has led to the exploration of 3-D IC technology, which possesses attractive benefits in form factor, density, performance, heterogeneous integration, and lower cost. One of the key challenges to realize 3-D integration i...