Advanced microchip cooling

• Main Author: Chua, Boon Tarn.
• Other Authors: Li King Ho Holden
• Format: Final Year Project
• Language: English
• Published: 2013
• Subjects: DRNTU::Engineering::Mechanical engineering::Fluid mechanics
• Online Access: http://hdl.handle.net/10356/53956
• Institution: Nanyang Technological University

Microchip was invented in 1958 and has been widely use in the electronic field since then. According to Moore’s law, the number of transistors on a microchip double every 18 month to 2 year, however heat generated is still proportional to the number of transistors. When microchip gets smaller, the density of transistors per unit area increases which also increases the heat generation. Therefore many microchip companies are still facing the heat problem. Given the current technology in the market, spray cooling had been a potential method to the problem. This project will explore how spray cooling technology can be efficiently combined with thermal ground plate so to maximize microchip cooling. The experiment will involve how various type of high conductivity materials coated on the microchip affect the heat dissipation rate, and also be looking at how the spray pressure and the orientation of spray affect the overall cooling effect on the microchip.. This report will show the methods and procedure used to obtain the result and further conclude on microchip cooling problem.