Bottom up electro deposition and flat surface finishing in micro-trench metal filling process

• Main Author: Guan, Aaron Zhi Xiong.
• Other Authors: School of Mechanical and Aerospace Engineering
• Format: Final Year Project
• Language: English
• Published: 2013
• Subjects: DRNTU::Engineering
• Online Access: http://hdl.handle.net/10356/54076
• Institution: Nanyang Technological University

Metal filling using electrode position usually results in a continuous layer deposition of metal in trenches. This report presents a simple method to achieve a bottom up nickel electrode position with flat surface finishing in micro trenches. A patterned substrate made of silicon wafer patterned by...