Fabrication and thermal stress analysis for PZT thin-layered structures

Multi-layered thin film structures with silicon as substrate are widely used in modern electronic industry as building blocks of micro devices and systems. When multiple thin film layers are deposited or grown on a silicon substrate, residual stresses are inevitably arisen inside the thin films d...

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Main Author:	Zhang, Yun.
Other Authors:	Xiao, Zhongmin
Format:	Theses and Dissertations
Published:	2008
Subjects:	DRNTU::Engineering::Manufacturing
Online Access:	http://hdl.handle.net/10356/5546
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Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-5546
record_format	dspace
spelling	sg-ntu-dr.10356-55462023-03-11T17:25:04Z Fabrication and thermal stress analysis for PZT thin-layered structures Zhang, Yun. Xiao, Zhongmin School of Mechanical and Production Engineering DRNTU::Engineering::Manufacturing Multi-layered thin film structures with silicon as substrate are widely used in modern electronic industry as building blocks of micro devices and systems. When multiple thin film layers are deposited or grown on a silicon substrate, residual stresses are inevitably arisen inside the thin films due to thermal mismatch, phase transfer, and chemical reaction, etc. The residual stress induced cracking and damage is always the main concern in design and fabrication process of novel micro-mechanical devices, as these stresses frequently provide the driving force for mechanical and functional failure. Master of Science (Mechanics & Processing of Materials) 2008-09-17T10:53:08Z 2008-09-17T10:53:08Z 2004 2004 Thesis http://hdl.handle.net/10356/5546 Nanyang Technological University application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Manufacturing
spellingShingle	DRNTU::Engineering::Manufacturing Zhang, Yun. Fabrication and thermal stress analysis for PZT thin-layered structures
description	Multi-layered thin film structures with silicon as substrate are widely used in modern electronic industry as building blocks of micro devices and systems. When multiple thin film layers are deposited or grown on a silicon substrate, residual stresses are inevitably arisen inside the thin films due to thermal mismatch, phase transfer, and chemical reaction, etc. The residual stress induced cracking and damage is always the main concern in design and fabrication process of novel micro-mechanical devices, as these stresses frequently provide the driving force for mechanical and functional failure.
author2	Xiao, Zhongmin
author_facet	Xiao, Zhongmin Zhang, Yun.
format	Theses and Dissertations
author	Zhang, Yun.
author_sort	Zhang, Yun.
title	Fabrication and thermal stress analysis for PZT thin-layered structures
title_short	Fabrication and thermal stress analysis for PZT thin-layered structures
title_full	Fabrication and thermal stress analysis for PZT thin-layered structures
title_fullStr	Fabrication and thermal stress analysis for PZT thin-layered structures
title_full_unstemmed	Fabrication and thermal stress analysis for PZT thin-layered structures
title_sort	fabrication and thermal stress analysis for pzt thin-layered structures
publishDate	2008
url	http://hdl.handle.net/10356/5546
_version_	1761781608523759616

Fabrication and thermal stress analysis for PZT thin-layered structures

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