Thermo-mechanical reliability analysis of solder joints in surface mounted printed circuit board assemblies

• Main Author: Ang, Kar Hwee
• Other Authors: Pang, John Hock Lye
• Format: Theses and Dissertations
• Published: 2008
• Subjects: DRNTU::Engineering::Manufacturing
• Online Access: http://hdl.handle.net/10356/5696
• Institution: Nanyang Technological University

As the electronic packaging trend moves more toward finer pitch surface mount technology, solder joints play an even more important and crucial role in the reliability of these packages. Accelerated thermal cycling (ATC) and thermal shock (TS) test are the most common stress tests that have been use...