Wire sweep analysis for 16L SOIC package

In this paper, we will analyses the root cause of wire sweep and using CAE tools to simulate mold flow in the mold chase and optimize mold chase design. Taguchi Methods, DOE is also using to optimize molding process. 16L SOIC is our test vehicle, our target is reduce wire sweep from more than 10% to...

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Main Author: Gao, Zheng Yu.
Other Authors: Pang, John Hock Lye
Format: Theses and Dissertations
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/10356/5734
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Institution: Nanyang Technological University
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spelling sg-ntu-dr.10356-57342023-03-11T17:23:50Z Wire sweep analysis for 16L SOIC package Gao, Zheng Yu. Pang, John Hock Lye School of Mechanical and Production Engineering DRNTU::Engineering::Manufacturing In this paper, we will analyses the root cause of wire sweep and using CAE tools to simulate mold flow in the mold chase and optimize mold chase design. Taguchi Methods, DOE is also using to optimize molding process. 16L SOIC is our test vehicle, our target is reduce wire sweep from more than 10% to less than 5%. Master of Science (Precision Engineering) 2008-09-17T10:57:47Z 2008-09-17T10:57:47Z 2002 2002 Thesis http://hdl.handle.net/10356/5734 Nanyang Technological University application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
topic DRNTU::Engineering::Manufacturing
spellingShingle DRNTU::Engineering::Manufacturing
Gao, Zheng Yu.
Wire sweep analysis for 16L SOIC package
description In this paper, we will analyses the root cause of wire sweep and using CAE tools to simulate mold flow in the mold chase and optimize mold chase design. Taguchi Methods, DOE is also using to optimize molding process. 16L SOIC is our test vehicle, our target is reduce wire sweep from more than 10% to less than 5%.
author2 Pang, John Hock Lye
author_facet Pang, John Hock Lye
Gao, Zheng Yu.
format Theses and Dissertations
author Gao, Zheng Yu.
author_sort Gao, Zheng Yu.
title Wire sweep analysis for 16L SOIC package
title_short Wire sweep analysis for 16L SOIC package
title_full Wire sweep analysis for 16L SOIC package
title_fullStr Wire sweep analysis for 16L SOIC package
title_full_unstemmed Wire sweep analysis for 16L SOIC package
title_sort wire sweep analysis for 16l soic package
publishDate 2008
url http://hdl.handle.net/10356/5734
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