Analyses of steady and unsteady thermal behaviour of simulated electronic chips in a liquid cooled vertical rectangular channel

Analyses of steady and unsteady thermal behaviour of simulated electronic chips in a liquid cooled vertical rectangular channel

Steady-state and transient experiments are performed to study the single-phase heat transfer from four in-line simulated electronic chips in a vertical rectangular channel using water and FC-72 as the working fluids. The steady-state experimental data covers a laminar flow regime with Reynolds numbe...

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Main Author: Himangshu Bhowmik
Other Authors: Tso Chih Ping
Format: Theses and Dissertations
Published: 2008
Subjects:
DRNTU::Engineering::Mechanical engineering::Fluid mechanics
Online Access:https://hdl.handle.net/10356/5788
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Institution: Nanyang Technological University
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spelling sg-ntu-dr.10356-57882023-03-11T17:23:11Z Analyses of steady and unsteady thermal behaviour of simulated electronic chips in a liquid cooled vertical rectangular channel Himangshu Bhowmik Tso Chih Ping Tou Kwok Woon, Stephen School of Mechanical and Aerospace Engineering DRNTU::Engineering::Mechanical engineering::Fluid mechanics Steady-state and transient experiments are performed to study the single-phase heat transfer from four in-line simulated electronic chips in a vertical rectangular channel using water and FC-72 as the working fluids. The steady-state experimental data covers a laminar flow regime with Reynolds number based on channel hydraulic diameter and Reynolds number based on heater length ranging from 0 to 2220 and 0 to 2775 respectively. The heat flux ranges from 0.1 W/cm2 to 2.6 W/cm2 for steady- state mixed and forced convection heat transfer and 0.1 W/cm2 to 0.6 W/cm2 for steady-state natural convection heat transfer. DOCTOR OF PHILOSOPHY (MAE) 2008-09-17T10:59:04Z 2008-09-17T10:59:04Z 2005 2005 Thesis Himangshu, B. (2005). Analyses of steady and unsteady thermal behaviour of simulated electronic chips in a liquid cooled vertical rectangular channel. Doctoral thesis, Nanyang Technological University, Singapore. https://hdl.handle.net/10356/5788 10.32657/10356/5788 Nanyang Technological University application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
topic DRNTU::Engineering::Mechanical engineering::Fluid mechanics
spellingShingle DRNTU::Engineering::Mechanical engineering::Fluid mechanics
Himangshu Bhowmik
Analyses of steady and unsteady thermal behaviour of simulated electronic chips in a liquid cooled vertical rectangular channel
description Steady-state and transient experiments are performed to study the single-phase heat transfer from four in-line simulated electronic chips in a vertical rectangular channel using water and FC-72 as the working fluids. The steady-state experimental data covers a laminar flow regime with Reynolds number based on channel hydraulic diameter and Reynolds number based on heater length ranging from 0 to 2220 and 0 to 2775 respectively. The heat flux ranges from 0.1 W/cm2 to 2.6 W/cm2 for steady- state mixed and forced convection heat transfer and 0.1 W/cm2 to 0.6 W/cm2 for steady-state natural convection heat transfer.
author2 Tso Chih Ping
author_facet Tso Chih Ping
Himangshu Bhowmik
format Theses and Dissertations
author Himangshu Bhowmik
author_sort Himangshu Bhowmik
title Analyses of steady and unsteady thermal behaviour of simulated electronic chips in a liquid cooled vertical rectangular channel
title_short Analyses of steady and unsteady thermal behaviour of simulated electronic chips in a liquid cooled vertical rectangular channel
title_full Analyses of steady and unsteady thermal behaviour of simulated electronic chips in a liquid cooled vertical rectangular channel
title_fullStr Analyses of steady and unsteady thermal behaviour of simulated electronic chips in a liquid cooled vertical rectangular channel
title_full_unstemmed Analyses of steady and unsteady thermal behaviour of simulated electronic chips in a liquid cooled vertical rectangular channel
title_sort analyses of steady and unsteady thermal behaviour of simulated electronic chips in a liquid cooled vertical rectangular channel
publishDate 2008
url https://hdl.handle.net/10356/5788
_version_ 1761781916328001536

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