Enhanced microscale heat transfer in macro geometries : effect of flow field

With technology getting more advance, there has been a strong demand for new cooling methods to remove the heat dissipated particularly from the electrical components. It is expected that in the future, these electrical components will be able to generate over 1000 of heat flux, and conventional coo...

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書目詳細資料
主要作者: Siew, Dennis Weng Kin
其他作者: Ooi Kim Tiow
格式: Final Year Project
語言:English
出版: 2014
主題:
在線閱讀:http://hdl.handle.net/10356/60367
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