Enhanced microscale heat transfer in macro geometries : effect of flow field

• المؤلف الرئيسي: Siew, Dennis Weng Kin
• مؤلفون آخرون: Ooi Kim Tiow
• التنسيق: Final Year Project
• اللغة: English
• منشور في: 2014
• الموضوعات: DRNTU::Engineering::Mechanical engineering::Fluid mechanics
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/60367

With technology getting more advance, there has been a strong demand for new cooling methods to remove the heat dissipated particularly from the electrical components. It is expected that in the future, these electrical components will be able to generate over 1000 of heat flux, and conventional coo...