Ultrasonic bonding of microfluidic devices
The objective of this study was to find optimal bonding parameters to achieve desirable weld quality in terms of seal appearance and leak-proof sealing with proper microfluidic flow between a micro-mixer and a cover plate. Microfluidic micro-mixer plates with inlets and cover plates were manufacture...
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sg-ntu-dr.10356-605172020-11-01T11:38:51Z Ultrasonic bonding of microfluidic devices Tan, Wei Yung Tor Shu Beng School of Mechanical and Aerospace Engineering Singapore-MIT Alliance Programme DRNTU::Engineering::Manufacturing The objective of this study was to find optimal bonding parameters to achieve desirable weld quality in terms of seal appearance and leak-proof sealing with proper microfluidic flow between a micro-mixer and a cover plate. Microfluidic micro-mixer plates with inlets and cover plates were manufactured using SUMIPEX PMMA LG2 by injection moulding. A new and improved fixture for ultrasonic welding was designed and fabricated using Aluminium and Delrin for a comparison between rigid and resilient fixtures. Master of Science (IMST) 2014-05-28T01:37:29Z 2014-05-28T01:37:29Z 2010 2010 Thesis http://hdl.handle.net/10356/60517 en 87 p. application/pdf |
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Singapore Singapore |
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English |
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DRNTU::Engineering::Manufacturing |
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DRNTU::Engineering::Manufacturing Tan, Wei Yung Ultrasonic bonding of microfluidic devices |
| description |
The objective of this study was to find optimal bonding parameters to achieve desirable weld quality in terms of seal appearance and leak-proof sealing with proper microfluidic flow between a micro-mixer and a cover plate. Microfluidic micro-mixer plates with inlets and cover plates were manufactured using SUMIPEX PMMA LG2 by injection moulding. A new and improved fixture for ultrasonic welding was designed and fabricated using Aluminium and Delrin for a comparison between rigid and resilient fixtures. |
| author2 |
Tor Shu Beng |
| author_facet |
Tor Shu Beng Tan, Wei Yung |
| format |
Theses and Dissertations |
| author |
Tan, Wei Yung |
| author_sort |
Tan, Wei Yung |
| title |
Ultrasonic bonding of microfluidic devices |
| title_short |
Ultrasonic bonding of microfluidic devices |
| title_full |
Ultrasonic bonding of microfluidic devices |
| title_fullStr |
Ultrasonic bonding of microfluidic devices |
| title_full_unstemmed |
Ultrasonic bonding of microfluidic devices |
| title_sort |
ultrasonic bonding of microfluidic devices |
| publishDate |
2014 |
| url |
http://hdl.handle.net/10356/60517 |
| _version_ |
1688665652721614848 |