Optimization of parameters for micro hot embossing of aluminum alloy with a silicon die
In the traditional micro hot embossing process, brittle silicon molds are particularly vulnerable to failure during demolding because of adhesion and thermal stress. Experiments have been developed to analyze the feasibility of using alternative mold materials. In this investigation, DOE (design of...
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| Format: | Theses and Dissertations |
| Language: | English |
| Published: |
2014
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| Online Access: | http://hdl.handle.net/10356/60579 |
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| Institution: | Nanyang Technological University |
| Language: | English |