APA引文

Lo, M. C. Y., & Zhong, Z. (2008). Process and reliability studies of solder bumping using eutectic sn/pb solder.

Chicago Style Citation

Lo, Marvin Chen Yang., and Zhaowei Zhong. Process and Reliability Studies of Solder Bumping Using Eutectic Sn/pb Solder. 2008.

MLA引文

Lo, Marvin Chen Yang., and Zhaowei Zhong. Process and Reliability Studies of Solder Bumping Using Eutectic Sn/pb Solder. 2008.

警告：這些引文格式不一定是100％准確.