Probe mark bondability study for B6HFC wafer technology - in relation to die pad damage and exposed oxide

This dissertation covers the experimental analysis of probe mark bondability fo BiCMOS wafer where the bond pads of size 100 micrometer by 100 micrometer were subjected to a matrix of touchdown and overdrive settings at ambient temperature during the wafer probing process.

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Bibliographic Details
Main Author:	Loh, Chee Ping.
Other Authors:	Zhong, Zhaowei
Format:	Theses and Dissertations
Published:	2008
Subjects:	DRNTU::Engineering::Manufacturing
Online Access:	http://hdl.handle.net/10356/6086
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Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-6086
record_format	dspace
spelling	sg-ntu-dr.10356-60862023-03-11T17:21:10Z Probe mark bondability study for B6HFC wafer technology - in relation to die pad damage and exposed oxide Loh, Chee Ping. Zhong, Zhaowei School of Mechanical and Production Engineering DRNTU::Engineering::Manufacturing This dissertation covers the experimental analysis of probe mark bondability fo BiCMOS wafer where the bond pads of size 100 micrometer by 100 micrometer were subjected to a matrix of touchdown and overdrive settings at ambient temperature during the wafer probing process. Master of Science (Precision Engineering) 2008-09-17T11:06:27Z 2008-09-17T11:06:27Z 2003 2003 Thesis http://hdl.handle.net/10356/6086 Nanyang Technological University application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Manufacturing
spellingShingle	DRNTU::Engineering::Manufacturing Loh, Chee Ping. Probe mark bondability study for B6HFC wafer technology - in relation to die pad damage and exposed oxide
description	This dissertation covers the experimental analysis of probe mark bondability fo BiCMOS wafer where the bond pads of size 100 micrometer by 100 micrometer were subjected to a matrix of touchdown and overdrive settings at ambient temperature during the wafer probing process.
author2	Zhong, Zhaowei
author_facet	Zhong, Zhaowei Loh, Chee Ping.
format	Theses and Dissertations
author	Loh, Chee Ping.
author_sort	Loh, Chee Ping.
title	Probe mark bondability study for B6HFC wafer technology - in relation to die pad damage and exposed oxide
title_short	Probe mark bondability study for B6HFC wafer technology - in relation to die pad damage and exposed oxide
title_full	Probe mark bondability study for B6HFC wafer technology - in relation to die pad damage and exposed oxide
title_fullStr	Probe mark bondability study for B6HFC wafer technology - in relation to die pad damage and exposed oxide
title_full_unstemmed	Probe mark bondability study for B6HFC wafer technology - in relation to die pad damage and exposed oxide
title_sort	probe mark bondability study for b6hfc wafer technology - in relation to die pad damage and exposed oxide
publishDate	2008
url	http://hdl.handle.net/10356/6086
_version_	1761781629060120576

Probe mark bondability study for B6HFC wafer technology - in relation to die pad damage and exposed oxide

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