Enhanced microscale heat transfer in macro geometry: effect of groove orientation and working fluid

The present era is the age of computing and this revolution is being powered by microchips that are becoming increasingly powerful by the day. This increase in processing power, however, is accompanied by very high heat dissipation in the range of 100 W/cm2. In fact, insufficient cooling for microch...

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Main Author: Jaishankar, Sunil Shankar
Other Authors: Ooi Kim Tiow
Format: Final Year Project
Language:English
Published: 2014
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Online Access:http://hdl.handle.net/10356/61363
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-613632023-03-04T18:32:52Z Enhanced microscale heat transfer in macro geometry: effect of groove orientation and working fluid Jaishankar, Sunil Shankar Ooi Kim Tiow School of Mechanical and Aerospace Engineering DRNTU::Engineering::Mechanical engineering::Fluid mechanics The present era is the age of computing and this revolution is being powered by microchips that are becoming increasingly powerful by the day. This increase in processing power, however, is accompanied by very high heat dissipation in the range of 100 W/cm2. In fact, insufficient cooling for microchips is seen as the single largest stumbling block in producing powerful computers. This project investigates the heat transfer at the microscale level to effectively carry away the heat produced, a phenomenon reported to be effective in the same by Tuckerman and Pease in 1981. This project aims to study the heat transfer performance of microchannels with grooved walls in the attempt to attain passive heat transfer augmentation. In continuation of previous works, the effect of groove geometry, in particular circular pitch and orientation of the grooves, is studied. Experiments and numerical simulations have been performed to deduce pressure drop and thermal characteristics of the microchannel flow with heat supplied at 26.5 and 15.9 W/cm2. In order to create the microchannel, solid cylindrical rods, called inserts, made of stainless steel with conical ends are used in conjunction with external piping. The space in between the insert and the external piping creates the annular microchannel investigated in this study. Grooves are fabricated on the insert surface in order to enhance heat transfer. Numerical simulations were also performed to investigate the effect of using air as the working fluid as against water for the other investigations. Investigations revealed that increasing the circular pitch of the grooves results in a decrease in both total pressure drop and heat transfer coefficient. Increasing the orientation angle of the groove was found to increase the heat transfer coefficient by 16.00% on average while subjected to an acceptable pressure penalty between 12.8 kPa to 143.8 kPa depending on insert and flow rate. Finally, the use of air as the working fluid revealed that water generally performs better than air in terms of heat transfer performance with water having 12% higher Nusselt number at Reynolds number of 1000 and 182% higher Nusselt number at Reynolds number of 5500. Bachelor of Engineering (Mechanical Engineering) 2014-06-09T07:08:00Z 2014-06-09T07:08:00Z 2014 2014 Final Year Project (FYP) http://hdl.handle.net/10356/61363 en Nanyang Technological University 88 p. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic DRNTU::Engineering::Mechanical engineering::Fluid mechanics
spellingShingle DRNTU::Engineering::Mechanical engineering::Fluid mechanics
Jaishankar, Sunil Shankar
Enhanced microscale heat transfer in macro geometry: effect of groove orientation and working fluid
description The present era is the age of computing and this revolution is being powered by microchips that are becoming increasingly powerful by the day. This increase in processing power, however, is accompanied by very high heat dissipation in the range of 100 W/cm2. In fact, insufficient cooling for microchips is seen as the single largest stumbling block in producing powerful computers. This project investigates the heat transfer at the microscale level to effectively carry away the heat produced, a phenomenon reported to be effective in the same by Tuckerman and Pease in 1981. This project aims to study the heat transfer performance of microchannels with grooved walls in the attempt to attain passive heat transfer augmentation. In continuation of previous works, the effect of groove geometry, in particular circular pitch and orientation of the grooves, is studied. Experiments and numerical simulations have been performed to deduce pressure drop and thermal characteristics of the microchannel flow with heat supplied at 26.5 and 15.9 W/cm2. In order to create the microchannel, solid cylindrical rods, called inserts, made of stainless steel with conical ends are used in conjunction with external piping. The space in between the insert and the external piping creates the annular microchannel investigated in this study. Grooves are fabricated on the insert surface in order to enhance heat transfer. Numerical simulations were also performed to investigate the effect of using air as the working fluid as against water for the other investigations. Investigations revealed that increasing the circular pitch of the grooves results in a decrease in both total pressure drop and heat transfer coefficient. Increasing the orientation angle of the groove was found to increase the heat transfer coefficient by 16.00% on average while subjected to an acceptable pressure penalty between 12.8 kPa to 143.8 kPa depending on insert and flow rate. Finally, the use of air as the working fluid revealed that water generally performs better than air in terms of heat transfer performance with water having 12% higher Nusselt number at Reynolds number of 1000 and 182% higher Nusselt number at Reynolds number of 5500.
author2 Ooi Kim Tiow
author_facet Ooi Kim Tiow
Jaishankar, Sunil Shankar
format Final Year Project
author Jaishankar, Sunil Shankar
author_sort Jaishankar, Sunil Shankar
title Enhanced microscale heat transfer in macro geometry: effect of groove orientation and working fluid
title_short Enhanced microscale heat transfer in macro geometry: effect of groove orientation and working fluid
title_full Enhanced microscale heat transfer in macro geometry: effect of groove orientation and working fluid
title_fullStr Enhanced microscale heat transfer in macro geometry: effect of groove orientation and working fluid
title_full_unstemmed Enhanced microscale heat transfer in macro geometry: effect of groove orientation and working fluid
title_sort enhanced microscale heat transfer in macro geometry: effect of groove orientation and working fluid
publishDate 2014
url http://hdl.handle.net/10356/61363
_version_ 1759855401950511104