Optimisation of the preclean II bell jar surface for reduction of defect density

Most of the etched materials are adhered on the bell jar surface and some of them are pumped away by the Turbo pump. The bell jar is installed on top of the PCII chamber and the inner surface is under vacuum and the outer one is exposed to the atmosphere. The PCII process take place inside the cham...

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Bibliographic Details
Main Author:	Maung Phone Naing.
Other Authors:	Butler, David Lee
Format:	Theses and Dissertations
Published:	2008
Subjects:	DRNTU::Engineering::Manufacturing
Online Access:	http://hdl.handle.net/10356/6149
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-6149
record_format	dspace
spelling	sg-ntu-dr.10356-61492023-03-11T17:07:56Z Optimisation of the preclean II bell jar surface for reduction of defect density Maung Phone Naing. Butler, David Lee School of Mechanical and Production Engineering DRNTU::Engineering::Manufacturing Most of the etched materials are adhered on the bell jar surface and some of them are pumped away by the Turbo pump. The bell jar is installed on top of the PCII chamber and the inner surface is under vacuum and the outer one is exposed to the atmosphere. The PCII process take place inside the chamber and it is under vacuum condition. The etched materials do not adheres well onto the bell jar surface due to the improper surface texture and instead fall onto the semiconductor wafer. Master of Science (Precision Engineering) 2008-09-17T11:07:53Z 2008-09-17T11:07:53Z 2004 2004 Thesis http://hdl.handle.net/10356/6149 Nanyang Technological University application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Manufacturing
spellingShingle	DRNTU::Engineering::Manufacturing Maung Phone Naing. Optimisation of the preclean II bell jar surface for reduction of defect density
description	Most of the etched materials are adhered on the bell jar surface and some of them are pumped away by the Turbo pump. The bell jar is installed on top of the PCII chamber and the inner surface is under vacuum and the outer one is exposed to the atmosphere. The PCII process take place inside the chamber and it is under vacuum condition. The etched materials do not adheres well onto the bell jar surface due to the improper surface texture and instead fall onto the semiconductor wafer.
author2	Butler, David Lee
author_facet	Butler, David Lee Maung Phone Naing.
format	Theses and Dissertations
author	Maung Phone Naing.
author_sort	Maung Phone Naing.
title	Optimisation of the preclean II bell jar surface for reduction of defect density
title_short	Optimisation of the preclean II bell jar surface for reduction of defect density
title_full	Optimisation of the preclean II bell jar surface for reduction of defect density
title_fullStr	Optimisation of the preclean II bell jar surface for reduction of defect density
title_full_unstemmed	Optimisation of the preclean II bell jar surface for reduction of defect density
title_sort	optimisation of the preclean ii bell jar surface for reduction of defect density
publishDate	2008
url	http://hdl.handle.net/10356/6149
_version_	1761781308170698752

Optimisation of the preclean II bell jar surface for reduction of defect density

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