Operating curve management application for productivity improvement at wirebond

Operating curve management application for productivity improvement at wirebond

Introduce the Operating Curve Management (OCM) concept and its application in the wirebonding process in the semiconductor environment, to allow the user to localize and optimize the available resources, to judge the potential of different improvement alternatives and to rate the results of the impr...

Full description

Saved in:
Bibliographic Details
Main Author: Ooi, Theng Hock.
Other Authors: Butler, David Lee
Format: Theses and Dissertations
Published: 2008
Subjects:
DRNTU::Engineering::Manufacturing::Production management
Online Access:http://hdl.handle.net/10356/6246
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: Nanyang Technological University
id sg-ntu-dr.10356-6246
record_format dspace
spelling sg-ntu-dr.10356-62462023-03-11T17:34:13Z Operating curve management application for productivity improvement at wirebond Ooi, Theng Hock. Butler, David Lee School of Mechanical and Production Engineering DRNTU::Engineering::Manufacturing::Production management Introduce the Operating Curve Management (OCM) concept and its application in the wirebonding process in the semiconductor environment, to allow the user to localize and optimize the available resources, to judge the potential of different improvement alternatives and to rate the results of the improvement actions. Master of Science (Computer Integrated Manufacturing) 2008-09-17T11:10:13Z 2008-09-17T11:10:13Z 2004 2004 Thesis http://hdl.handle.net/10356/6246 Nanyang Technological University application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
topic DRNTU::Engineering::Manufacturing::Production management
spellingShingle DRNTU::Engineering::Manufacturing::Production management
Ooi, Theng Hock.
Operating curve management application for productivity improvement at wirebond
description Introduce the Operating Curve Management (OCM) concept and its application in the wirebonding process in the semiconductor environment, to allow the user to localize and optimize the available resources, to judge the potential of different improvement alternatives and to rate the results of the improvement actions.
author2 Butler, David Lee
author_facet Butler, David Lee
Ooi, Theng Hock.
format Theses and Dissertations
author Ooi, Theng Hock.
author_sort Ooi, Theng Hock.
title Operating curve management application for productivity improvement at wirebond
title_short Operating curve management application for productivity improvement at wirebond
title_full Operating curve management application for productivity improvement at wirebond
title_fullStr Operating curve management application for productivity improvement at wirebond
title_full_unstemmed Operating curve management application for productivity improvement at wirebond
title_sort operating curve management application for productivity improvement at wirebond
publishDate 2008
url http://hdl.handle.net/10356/6246
_version_ 1761781782949134336

Similar Items