Ong, R. X., & Lip, G. C. (2015). Investigation of interconnect layout on CU/Low-K TDDB reliability.
Chicago Style CitationOng, Ran Xing, and Gan Chee Lip. Investigation of Interconnect Layout On CU/Low-K TDDB Reliability. 2015.
MLA CitationOng, Ran Xing, and Gan Chee Lip. Investigation of Interconnect Layout On CU/Low-K TDDB Reliability. 2015.
Warning: These citations may not always be 100% accurate.