Ong, R. X., & Lip, G. C. (2015). Investigation of interconnect layout on CU/Low-K TDDB reliability.
استشهاد بنمط شيكاغوOng, Ran Xing, و Gan Chee Lip. Investigation of Interconnect Layout On CU/Low-K TDDB Reliability. 2015.
MLA استشهادOng, Ran Xing, و Gan Chee Lip. Investigation of Interconnect Layout On CU/Low-K TDDB Reliability. 2015.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.