APA引文

Ong, R. X., & Lip, G. C. (2015). Investigation of interconnect layout on CU/Low-K TDDB reliability.

Chicago Style Citation

Ong, Ran Xing, and Gan Chee Lip. Investigation of Interconnect Layout On CU/Low-K TDDB Reliability. 2015.

MLA引文

Ong, Ran Xing, and Gan Chee Lip. Investigation of Interconnect Layout On CU/Low-K TDDB Reliability. 2015.

警告：這些引文格式不一定是100％准確.