Development of high strength gold bonding wires for fine pitch wire bonding process

Development of high strength gold bonding wires for fine pitch wire bonding process

This project focused on the development of new gold bonding wires, which has high modulus and break load. Various combinations of alloying elements were used to dope the pure gold forming different alloys. The mechanical properties including break load at certain elongation level and elastic modulus...

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Main Author: Dong, Albert Renjun
Other Authors: School of Mechanical and Production Engineering
Format: Theses and Dissertations
Published: 2008
Subjects:
DRNTU::Engineering::Manufacturing
Online Access:http://hdl.handle.net/10356/6450
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Institution: Nanyang Technological University
id sg-ntu-dr.10356-6450
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spelling sg-ntu-dr.10356-64502023-03-11T17:11:19Z Development of high strength gold bonding wires for fine pitch wire bonding process Dong, Albert Renjun School of Mechanical and Production Engineering DRNTU::Engineering::Manufacturing This project focused on the development of new gold bonding wires, which has high modulus and break load. Various combinations of alloying elements were used to dope the pure gold forming different alloys. The mechanical properties including break load at certain elongation level and elastic modulus were used to determine the effectiveness of alloy strengthening element. It was found that Beryllium, and Calcium have most strengthening effect at low concentration level while Platinum and Copper have very good strengthening effect at high concentration level. Master of Science 2008-09-17T11:15:16Z 2008-09-17T11:15:16Z 2000 2000 Thesis http://hdl.handle.net/10356/6450 Nanyang Technological University application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
topic DRNTU::Engineering::Manufacturing
spellingShingle DRNTU::Engineering::Manufacturing
Dong, Albert Renjun
Development of high strength gold bonding wires for fine pitch wire bonding process
description This project focused on the development of new gold bonding wires, which has high modulus and break load. Various combinations of alloying elements were used to dope the pure gold forming different alloys. The mechanical properties including break load at certain elongation level and elastic modulus were used to determine the effectiveness of alloy strengthening element. It was found that Beryllium, and Calcium have most strengthening effect at low concentration level while Platinum and Copper have very good strengthening effect at high concentration level.
author2 School of Mechanical and Production Engineering
author_facet School of Mechanical and Production Engineering
Dong, Albert Renjun
format Theses and Dissertations
author Dong, Albert Renjun
author_sort Dong, Albert Renjun
title Development of high strength gold bonding wires for fine pitch wire bonding process
title_short Development of high strength gold bonding wires for fine pitch wire bonding process
title_full Development of high strength gold bonding wires for fine pitch wire bonding process
title_fullStr Development of high strength gold bonding wires for fine pitch wire bonding process
title_full_unstemmed Development of high strength gold bonding wires for fine pitch wire bonding process
title_sort development of high strength gold bonding wires for fine pitch wire bonding process
publishDate 2008
url http://hdl.handle.net/10356/6450
_version_ 1761781444742479872

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