Enhancement of flow boiling using 3D printed porous structures
With the consistently rising demand for better and more efficient electronic systems over the years, there is a need for high-performing microprocessors. However, the increase in performance of the microprocessors is often accompanied with rising heat dissipation. Hence, in order to keep up with fut...
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格式: | Final Year Project |
語言: | English |
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2015
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在線閱讀: | http://hdl.handle.net/10356/64722 |
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