Bonding inspection using ultrasonic methods

The purpose of this project was to apply the ultrasonic Time-of-Flight Diffraction technique to inspect and characterize the bonding condition between two metal blocks. Two aluminium block was chosen to be bonded together using epoxy adhesive and a few teflon fragments were put inside the bonding to...

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Main Author: Cheng, Xu
Other Authors: Fan Zheng,David
Format: Final Year Project
Language:English
Published: 2015
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Online Access:http://hdl.handle.net/10356/65011
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-650112023-03-04T18:16:40Z Bonding inspection using ultrasonic methods Cheng, Xu Fan Zheng,David School of Mechanical and Aerospace Engineering DRNTU::Engineering::Mechanical engineering The purpose of this project was to apply the ultrasonic Time-of-Flight Diffraction technique to inspect and characterize the bonding condition between two metal blocks. Two aluminium block was chosen to be bonded together using epoxy adhesive and a few teflon fragments were put inside the bonding to form defects artificially. By connecting two wedge transducers to a handyscope, a simple TOFD apparatus with A-scan output was created to be used to conduct some experiments. Multi-group experiments were conducted, including checking the functionality of the device, testing the actual compression wave propagation speed in the specimen, TOFD inspection over the interated part and bonding area of the specimen. The results shown that the equipment were working well and the compression wave speed was close to the theoretical value. However, the signals acquired were not good as expected in terms of those TOFD inspection. The problem encountered was that there was no such significant pulse signal generated by compression wave which was expected to be used for signal analysis. Furthermore, for the experiments conducted over the bonded part, the signal got was just at the same level as the noise signal. The reasons for the failure in getting a good result as expected were complicated. Limitation of centre frequency for probe and the poor singal processing equipment were the two major causes. Inappropriate choice of bonding material and method also had a adverse effect on the experimental results. Even so, this project was a good pilot in applying theoretical method in practice, the work done in the project was a good reference for further study. In order to make full use of the TOFD mecthod, improvement in both equipment and the design of experiment should be done for future work. Bachelor of Engineering (Mechanical Engineering) 2015-06-10T05:57:42Z 2015-06-10T05:57:42Z 2015 2015 Final Year Project (FYP) http://hdl.handle.net/10356/65011 en Nanyang Technological University 40 p. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic DRNTU::Engineering::Mechanical engineering
spellingShingle DRNTU::Engineering::Mechanical engineering
Cheng, Xu
Bonding inspection using ultrasonic methods
description The purpose of this project was to apply the ultrasonic Time-of-Flight Diffraction technique to inspect and characterize the bonding condition between two metal blocks. Two aluminium block was chosen to be bonded together using epoxy adhesive and a few teflon fragments were put inside the bonding to form defects artificially. By connecting two wedge transducers to a handyscope, a simple TOFD apparatus with A-scan output was created to be used to conduct some experiments. Multi-group experiments were conducted, including checking the functionality of the device, testing the actual compression wave propagation speed in the specimen, TOFD inspection over the interated part and bonding area of the specimen. The results shown that the equipment were working well and the compression wave speed was close to the theoretical value. However, the signals acquired were not good as expected in terms of those TOFD inspection. The problem encountered was that there was no such significant pulse signal generated by compression wave which was expected to be used for signal analysis. Furthermore, for the experiments conducted over the bonded part, the signal got was just at the same level as the noise signal. The reasons for the failure in getting a good result as expected were complicated. Limitation of centre frequency for probe and the poor singal processing equipment were the two major causes. Inappropriate choice of bonding material and method also had a adverse effect on the experimental results. Even so, this project was a good pilot in applying theoretical method in practice, the work done in the project was a good reference for further study. In order to make full use of the TOFD mecthod, improvement in both equipment and the design of experiment should be done for future work.
author2 Fan Zheng,David
author_facet Fan Zheng,David
Cheng, Xu
format Final Year Project
author Cheng, Xu
author_sort Cheng, Xu
title Bonding inspection using ultrasonic methods
title_short Bonding inspection using ultrasonic methods
title_full Bonding inspection using ultrasonic methods
title_fullStr Bonding inspection using ultrasonic methods
title_full_unstemmed Bonding inspection using ultrasonic methods
title_sort bonding inspection using ultrasonic methods
publishDate 2015
url http://hdl.handle.net/10356/65011
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