Design analysis of data links in 2.5 dics
As the trend of device integration moves from VLSI to ULSI, number of problems have arisen for 3 dimensional integration of ICs with TSV technology. The increasing complexity and number of components on the substrate is expected to rise faster before Nano-technology takes over. 2.5DICs are a viable...
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| 格式: | Theses and Dissertations |
| 語言: | English |
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2015
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| 主題: | |
| 在線閱讀: | http://hdl.handle.net/10356/65074 |
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