Design methodologies and digital circuit implementation for 3DIC wireless sensor node (WSN) system

In recent years, there is a great deal of interest in the three-dimensional integrated circuit (3D IC). By stacking multiple active device layers with vertical interconnect, 3D IC technology provides great opportunities for designers to meet power and performance requirements. In this research,...

Full description

Saved in:
Bibliographic Details
Main Author: Lan, Jingjing
Other Authors: Liu Xin
Format: Theses and Dissertations
Language:English
Published: 2012
Subjects:
Online Access:https://hdl.handle.net/10356/50626
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: Nanyang Technological University
Language: English