Design methodologies and digital circuit implementation for 3DIC wireless sensor node (WSN) system

In recent years, there is a great deal of interest in the three-dimensional integrated circuit (3D IC). By stacking multiple active device layers with vertical interconnect, 3D IC technology provides great opportunities for designers to meet power and performance requirements. In this research,...

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Main Author: Lan, Jingjing
Other Authors: Liu Xin
Format: Theses and Dissertations
Language:English
Published: 2012
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Online Access:https://hdl.handle.net/10356/50626
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-506262023-07-04T16:45:57Z Design methodologies and digital circuit implementation for 3DIC wireless sensor node (WSN) system Lan, Jingjing Liu Xin Goh Wang Ling School of Electrical and Electronic Engineering A*STAR Institute of Microelectronics Centre for Integrated Circuits and Systems DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits In recent years, there is a great deal of interest in the three-dimensional integrated circuit (3D IC). By stacking multiple active device layers with vertical interconnect, 3D IC technology provides great opportunities for designers to meet power and performance requirements. In this research, the innovative 3D IC technology is employed as a basic tool. In addition to the conventional horizontal dimension, active devices are stacked in the vertical dimension in 3D IC technology. The additional degree of connectivity in the vertical dimension enables circuit designers to replace long horizontal wires with short vertical interconnects, so that delay, power consumption, and area can be reduced. The design problem of miniaturized wireless sensor node has been explored and a digital core design in wireless sensor node is proposed in this work. The design aims to provide an efficient solution for recording users’ bio-vital data, as well as to transmit, extract and deposit the information on the platform. This capability serves to monitor the progression of chronic diseases. The 3D architecture for a wireless sensor node will be discussed in-depth and the impact of 3D-integration technology on conventional digital circuit design will be demonstrated in this project too. Through silicon via (TSV) based 3D integration technology is employed as the vertical interconnect methodology. The proposed design methodologies described in this thesis are intended to strengthen the 3D design capabilities, making this fascinating technology a promising solution for future integrated systems. Functional tests were conducted to validate the overall systems usability and modularity and the measured results proved that reliable data transfer and continuous bio-vital data monitoring can be consistently achieved. The measured results validated the approaches chosen, and verified that the system is useful in patient monitoring application. The next phase of the work will be to implement the proposed digital core design in 3D wireless sensor node in field programmable gate array (FPGA). MASTER OF ENGINEERING (EEE) 2012-08-07T09:03:31Z 2012-08-07T09:03:31Z 2012 2012 Thesis Lan, J. (2012). Design methodologies and digital circuit implementation for 3DIC wireless sensor node (WSN) system. Master’s thesis, Nanyang Technological University, Singapore. https://hdl.handle.net/10356/50626 10.32657/10356/50626 en 169 p. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits
spellingShingle DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits
Lan, Jingjing
Design methodologies and digital circuit implementation for 3DIC wireless sensor node (WSN) system
description In recent years, there is a great deal of interest in the three-dimensional integrated circuit (3D IC). By stacking multiple active device layers with vertical interconnect, 3D IC technology provides great opportunities for designers to meet power and performance requirements. In this research, the innovative 3D IC technology is employed as a basic tool. In addition to the conventional horizontal dimension, active devices are stacked in the vertical dimension in 3D IC technology. The additional degree of connectivity in the vertical dimension enables circuit designers to replace long horizontal wires with short vertical interconnects, so that delay, power consumption, and area can be reduced. The design problem of miniaturized wireless sensor node has been explored and a digital core design in wireless sensor node is proposed in this work. The design aims to provide an efficient solution for recording users’ bio-vital data, as well as to transmit, extract and deposit the information on the platform. This capability serves to monitor the progression of chronic diseases. The 3D architecture for a wireless sensor node will be discussed in-depth and the impact of 3D-integration technology on conventional digital circuit design will be demonstrated in this project too. Through silicon via (TSV) based 3D integration technology is employed as the vertical interconnect methodology. The proposed design methodologies described in this thesis are intended to strengthen the 3D design capabilities, making this fascinating technology a promising solution for future integrated systems. Functional tests were conducted to validate the overall systems usability and modularity and the measured results proved that reliable data transfer and continuous bio-vital data monitoring can be consistently achieved. The measured results validated the approaches chosen, and verified that the system is useful in patient monitoring application. The next phase of the work will be to implement the proposed digital core design in 3D wireless sensor node in field programmable gate array (FPGA).
author2 Liu Xin
author_facet Liu Xin
Lan, Jingjing
format Theses and Dissertations
author Lan, Jingjing
author_sort Lan, Jingjing
title Design methodologies and digital circuit implementation for 3DIC wireless sensor node (WSN) system
title_short Design methodologies and digital circuit implementation for 3DIC wireless sensor node (WSN) system
title_full Design methodologies and digital circuit implementation for 3DIC wireless sensor node (WSN) system
title_fullStr Design methodologies and digital circuit implementation for 3DIC wireless sensor node (WSN) system
title_full_unstemmed Design methodologies and digital circuit implementation for 3DIC wireless sensor node (WSN) system
title_sort design methodologies and digital circuit implementation for 3dic wireless sensor node (wsn) system
publishDate 2012
url https://hdl.handle.net/10356/50626
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