Mist cooling for the electric card

• Main Author: Lam, Yan Feng
• Other Authors: Fei Duan
• Format: Final Year Project
• Language: English
• Published: 2015
• Subjects: DRNTU::Engineering::Mechanical engineering
• Online Access: http://hdl.handle.net/10356/65687
• Institution: Nanyang Technological University

With the evolution of technology such as integrated chips on electric card, better heat dissipation techniques are demanded to cope with the increased power density. Traditionally, air or water cooling solutions were utilized. However, these methods are soon unable to keep up with the new requiremen...