Mist cooling for the electric card
With the evolution of technology such as integrated chips on electric card, better heat dissipation techniques are demanded to cope with the increased power density. Traditionally, air or water cooling solutions were utilized. However, these methods are soon unable to keep up with the new requiremen...
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| 主要作者: | |
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| 格式: | Final Year Project |
| 語言: | English |
| 出版: |
2015
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| 主題: | |
| 在線閱讀: | http://hdl.handle.net/10356/65687 |
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| 機構: | Nanyang Technological University |
| 語言: | English |