A micro-model for investigating the effective thermal property of a microscopically damaged interface

• Main Author: Choong, Li Xing
• Other Authors: Ang Whye Teong
• Format: Final Year Project
• Language: English
• Published: 2015
• Subjects: DRNTU::Engineering::Mechanical engineering
• Online Access: http://hdl.handle.net/10356/65790
• Institution: Nanyang Technological University

Thermal property of a material is very important when heat transfer is concerned. Properties of a material vary as external environment such as pressure and temperature changes. Each material has its physical properties that determine its’ conductivity and understanding these properties will enable better comprehension on how much heat is transferred. In this present report, a parametric study is carried out to determine the effective thermal property of a microscopically damaged interface. Two materials of different thermal properties are bonded together. Ideally, no cracks should be found between the interface. The report evaluates the change in thermal properties in the interface between the two conducting solids. The parameters to be studied in this report are the thermal conductivities of each material, the micro-cracks density, the average micro-crack length, the number of micro-cracks in the interface and the configuration of the micro-cracks. A relationship between between the effective thermal property of the interface and the parameters is then to be determined.