Report on industrial attachment with Hewlett-Packard (Singapore) Pte Ltd
This report focuses on, but not limited to, crack die e-test failure behavior of TIJ 2.X generation of HP print heads. The main interest of this project is to characterize the failures, especially, but not limited to, crack die. Means of electrical test and visual inspections are used extensively to...
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2008
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sg-ntu-dr.10356-67982023-03-04T15:40:23Z Report on industrial attachment with Hewlett-Packard (Singapore) Pte Ltd Albertus, Denny Handoko School of Materials Science & Engineering DRNTU::Engineering::Materials This report focuses on, but not limited to, crack die e-test failure behavior of TIJ 2.X generation of HP print heads. The main interest of this project is to characterize the failures, especially, but not limited to, crack die. Means of electrical test and visual inspections are used extensively to identify individual failures. 2008-09-17T14:27:31Z 2008-09-17T14:27:31Z 2004 2004 Industrial Attachment (IA) http://hdl.handle.net/10356/6798 Nanyang Technological University 66 p. application/pdf |
| institution |
Nanyang Technological University |
| building |
NTU Library |
| continent |
Asia |
| country |
Singapore Singapore |
| content_provider |
NTU Library |
| collection |
DR-NTU |
| topic |
DRNTU::Engineering::Materials |
| spellingShingle |
DRNTU::Engineering::Materials Albertus, Denny Handoko Report on industrial attachment with Hewlett-Packard (Singapore) Pte Ltd |
| description |
This report focuses on, but not limited to, crack die e-test failure behavior of TIJ 2.X generation of HP print heads. The main interest of this project is to characterize the failures, especially, but not limited to, crack die. Means of electrical test and visual inspections are used extensively to identify individual failures. |
| author2 |
School of Materials Science & Engineering |
| author_facet |
School of Materials Science & Engineering Albertus, Denny Handoko |
| format |
Industrial Attachment (IA) |
| author |
Albertus, Denny Handoko |
| author_sort |
Albertus, Denny Handoko |
| title |
Report on industrial attachment with Hewlett-Packard (Singapore) Pte Ltd |
| title_short |
Report on industrial attachment with Hewlett-Packard (Singapore) Pte Ltd |
| title_full |
Report on industrial attachment with Hewlett-Packard (Singapore) Pte Ltd |
| title_fullStr |
Report on industrial attachment with Hewlett-Packard (Singapore) Pte Ltd |
| title_full_unstemmed |
Report on industrial attachment with Hewlett-Packard (Singapore) Pte Ltd |
| title_sort |
report on industrial attachment with hewlett-packard (singapore) pte ltd |
| publishDate |
2008 |
| url |
http://hdl.handle.net/10356/6798 |
| _version_ |
1759855154040930304 |