Wireless sensor for measurement of strain and crack in structures

• Main Author: Hou, Xiao
• Other Authors: Soh Chee Kiong
• Format: Final Year Project
• Language: English
• Published: 2016
• Subjects: DRNTU::Engineering::Civil engineering::Structures and design
• Online Access: http://hdl.handle.net/10356/68110
• Institution: Nanyang Technological University

Structural Health Monitoring (SHM) technology has been developing fast in the recent past. Wireless sensing technology has becoming a popular topic in SHM with the advancement of electrical and electronic technology. Very high potential applications can be seen if we use wireless technology in SHM, but it is yet in a stage of developing and validating. This Final Year Project (FYP) comprises of application of the LORD MicroStrain wireless sensing kit (V-Link Node, WSDA Base Station and 1000-ohm strain gauges) under various Non-Destructive Testing (NDT) experiments to verify the capacity of the wireless sensing device and evaluate the potential of the new wireless sensing device for SHM applications. Several experiments showed the capacity of the wireless sensor to maintain data stability over distance, detect damages and loadings and capture real-time signals with high sensitivity.