Characterization of polymeric thermal expander

This report presents the material properties of a silicone resin, Silres H62 C. The experiments were carried out in several ways including compression tests, DMA (Dynamic Mechanical Analysis) and TMA (Thermo Mechanical Analysis). The material Silres H62 C were configured in both non-constrained and...

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Main Author: Chua, Chi Ann
Other Authors: Lau Gih Keong
Format: Final Year Project
Language:English
Published: 2016
Subjects:
Online Access:http://hdl.handle.net/10356/68426
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-684262023-03-04T18:38:49Z Characterization of polymeric thermal expander Chua, Chi Ann Lau Gih Keong School of Mechanical and Aerospace Engineering MicroMachines Centre DRNTU::Engineering::Mechanical engineering This report presents the material properties of a silicone resin, Silres H62 C. The experiments were carried out in several ways including compression tests, DMA (Dynamic Mechanical Analysis) and TMA (Thermo Mechanical Analysis). The material Silres H62 C were configured in both non-constrained and constrained forms under the same curing condition, 200°C for 21hours. According to the experimental results from TMA, the non-constrained linear coefficient of thermal expansion (CTE) of Silres H62 C is about 220ppm/°C at the temperature range from 100°C to 180°C.The constrained CTE of Silres H62 C is about 650ppm/°C temperature range from 100°C to 180°C. The Young’s modulus obtained from compression test is 250MPa whereas the storage modulus obtained from single cantilever test (DMA) is 650MPa. The maximum thermal stress of constrained Silres H62 C occurs at 60°C for both static and dynamic condition. The maximum thermal stress is 8MPa at 10Hz frequency and 4MPa at static condition. Bachelor of Engineering (Mechanical Engineering) 2016-05-26T02:06:29Z 2016-05-26T02:06:29Z 2016 Final Year Project (FYP) http://hdl.handle.net/10356/68426 en Nanyang Technological University 56 p. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic DRNTU::Engineering::Mechanical engineering
spellingShingle DRNTU::Engineering::Mechanical engineering
Chua, Chi Ann
Characterization of polymeric thermal expander
description This report presents the material properties of a silicone resin, Silres H62 C. The experiments were carried out in several ways including compression tests, DMA (Dynamic Mechanical Analysis) and TMA (Thermo Mechanical Analysis). The material Silres H62 C were configured in both non-constrained and constrained forms under the same curing condition, 200°C for 21hours. According to the experimental results from TMA, the non-constrained linear coefficient of thermal expansion (CTE) of Silres H62 C is about 220ppm/°C at the temperature range from 100°C to 180°C.The constrained CTE of Silres H62 C is about 650ppm/°C temperature range from 100°C to 180°C. The Young’s modulus obtained from compression test is 250MPa whereas the storage modulus obtained from single cantilever test (DMA) is 650MPa. The maximum thermal stress of constrained Silres H62 C occurs at 60°C for both static and dynamic condition. The maximum thermal stress is 8MPa at 10Hz frequency and 4MPa at static condition.
author2 Lau Gih Keong
author_facet Lau Gih Keong
Chua, Chi Ann
format Final Year Project
author Chua, Chi Ann
author_sort Chua, Chi Ann
title Characterization of polymeric thermal expander
title_short Characterization of polymeric thermal expander
title_full Characterization of polymeric thermal expander
title_fullStr Characterization of polymeric thermal expander
title_full_unstemmed Characterization of polymeric thermal expander
title_sort characterization of polymeric thermal expander
publishDate 2016
url http://hdl.handle.net/10356/68426
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