Metal filling of micro-trench patterns by Ni electrodeposition at different potentials, inhibitor concentrations and angles to paddle agitation

• Main Author: Chou, Samuel Han Jian
• Other Authors: School of Mechanical and Aerospace Engineering
• Format: Final Year Project
• Language: English
• Published: 2016
• Subjects: DRNTU::Engineering
• Online Access: http://hdl.handle.net/10356/68631
• Institution: Nanyang Technological University

Microscale parts are manufactured using mechanical machining or manual labour. However, the products are not precise and the process is time consuming. Hence, electroplating is introduced. This report is to investigate the optimal conditions for electroplating to produce voidless metal filling at th...