Flow pattern and heat transfer in a tightly-spaced finned channel
Experiments and numerical simulations have been carried out to investigate the buoyancy-induced flow patterns and heat transfer characteristics of airflow through a horizontal rectangular channel in which the floor and the two sidewalls are heated and the ceiling is cooled. The study is conducted at...
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sg-ntu-dr.10356-68902023-03-04T18:09:13Z Flow pattern and heat transfer in a tightly-spaced finned channel Chua, Leok Poh. Huang, Xiaoyang. Yue, Chee Yoon School of Mechanical and Production Engineering DRNTU::Engineering::Mechanical engineering Experiments and numerical simulations have been carried out to investigate the buoyancy-induced flow patterns and heat transfer characteristics of airflow through a horizontal rectangular channel in which the floor and the two sidewalls are heated and the ceiling is cooled. The study is conducted at the Reynolds numbers ranging from 20 to 100 and Rayleigh numbers ranging from 100 to 4200. This work is motivated by heat transfer problems in microelectronic systems, and the channel, with an aspect ratio (A=b/d, where b and d are width and height of the channel) equals to 6, is used to simulate a finned heat sink in a densely-packed-electronic enclosure with low Reynolds and Rayleigh numbers. 2008-09-17T14:36:23Z 2008-09-17T14:36:23Z 2004 2004 Research Report http://hdl.handle.net/10356/6890 Nanyang Technological University application/pdf |
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DRNTU::Engineering::Mechanical engineering Chua, Leok Poh. Huang, Xiaoyang. Flow pattern and heat transfer in a tightly-spaced finned channel |
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Experiments and numerical simulations have been carried out to investigate the buoyancy-induced flow patterns and heat transfer characteristics of airflow through a horizontal rectangular channel in which the floor and the two sidewalls are heated and the ceiling is cooled. The study is conducted at the Reynolds numbers ranging from 20 to 100 and Rayleigh numbers ranging from 100 to 4200. This work is motivated by heat transfer problems in microelectronic systems, and the channel, with an aspect ratio (A=b/d, where b and d are width and height of the channel) equals to 6, is used to simulate a finned heat sink in a densely-packed-electronic enclosure with low Reynolds and Rayleigh numbers. |
author2 |
Yue, Chee Yoon |
author_facet |
Yue, Chee Yoon Chua, Leok Poh. Huang, Xiaoyang. |
format |
Research Report |
author |
Chua, Leok Poh. Huang, Xiaoyang. |
author_sort |
Chua, Leok Poh. |
title |
Flow pattern and heat transfer in a tightly-spaced finned channel |
title_short |
Flow pattern and heat transfer in a tightly-spaced finned channel |
title_full |
Flow pattern and heat transfer in a tightly-spaced finned channel |
title_fullStr |
Flow pattern and heat transfer in a tightly-spaced finned channel |
title_full_unstemmed |
Flow pattern and heat transfer in a tightly-spaced finned channel |
title_sort |
flow pattern and heat transfer in a tightly-spaced finned channel |
publishDate |
2008 |
url |
http://hdl.handle.net/10356/6890 |
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1759857619005079552 |