Development of micro flow control system
This final year project report describes the method of minimizing the bonding gap to achieve fully filled wells on the microfluidic chip. A minimum gap is required to enable the trapped air in the microfluidic chip to be expelled out. With the reduction of the bonding thickness, a greater depth is c...
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| Format: | Final Year Project |
| Language: | English |
| Published: |
2016
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| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/69401 |
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| Institution: | Nanyang Technological University |
| Language: | English |
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