Non-destructive analysis of microelectronic packages using computer x-ray tomography

Explores the capabities of using the 3D CT X-ray machine in evaluating multilayered stcked modules. Positioning of samples in machine was studied. Integrated images were used to compare with the micro cross section. Variation of various parameters such as voltage and current was done.

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Bibliographic Details
Main Author:	Yeo, Benjamin Jin Soon.
Other Authors:	Wong, Brian Stephen
Format:	Research Report
Published:	2008
Subjects:	DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
Online Access:	http://hdl.handle.net/10356/7015
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Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-7015
record_format	dspace
spelling	sg-ntu-dr.10356-70152023-03-04T18:08:25Z Non-destructive analysis of microelectronic packages using computer x-ray tomography Yeo, Benjamin Jin Soon. Wong, Brian Stephen School of Mechanical and Aerospace Engineering DRNTU::Engineering::Electrical and electronic engineering::Microelectronics Explores the capabities of using the 3D CT X-ray machine in evaluating multilayered stcked modules. Positioning of samples in machine was studied. Integrated images were used to compare with the micro cross section. Variation of various parameters such as voltage and current was done. 2008-09-18T05:58:57Z 2008-09-18T05:58:57Z 2006 2006 Research Report http://hdl.handle.net/10356/7015 Nanyang Technological University application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
spellingShingle	DRNTU::Engineering::Electrical and electronic engineering::Microelectronics Yeo, Benjamin Jin Soon. Non-destructive analysis of microelectronic packages using computer x-ray tomography
description	Explores the capabities of using the 3D CT X-ray machine in evaluating multilayered stcked modules. Positioning of samples in machine was studied. Integrated images were used to compare with the micro cross section. Variation of various parameters such as voltage and current was done.
author2	Wong, Brian Stephen
author_facet	Wong, Brian Stephen Yeo, Benjamin Jin Soon.
format	Research Report
author	Yeo, Benjamin Jin Soon.
author_sort	Yeo, Benjamin Jin Soon.
title	Non-destructive analysis of microelectronic packages using computer x-ray tomography
title_short	Non-destructive analysis of microelectronic packages using computer x-ray tomography
title_full	Non-destructive analysis of microelectronic packages using computer x-ray tomography
title_fullStr	Non-destructive analysis of microelectronic packages using computer x-ray tomography
title_full_unstemmed	Non-destructive analysis of microelectronic packages using computer x-ray tomography
title_sort	non-destructive analysis of microelectronic packages using computer x-ray tomography
publishDate	2008
url	http://hdl.handle.net/10356/7015
_version_	1759856517568266240

Non-destructive analysis of microelectronic packages using computer x-ray tomography

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