Mechanical and thermal characterization of flexible composite substrate

• Main Author: Low, Madeline Shin Yee
• Other Authors: Aravind Dasari
• Format: Final Year Project
• Language: English
• Published: 2017
• Subjects: DRNTU::Engineering::Materials::Composite materials
• Online Access: http://hdl.handle.net/10356/70356
• Institution: Nanyang Technological University

Woven glass/epoxy composite substrate is broadly used in the electronic industries due to its high strength to weight ratio and improved lateral properties as compared to laminated composites. The mechanical reliability of the woven epoxy glass composite substrate plays a crucial role in electronic packaging quality. The focus of this research is to determine the limiting mechanical reliability that puts boundaries on application of composite substrate and further, the damage issues faced by the companies on smart cards modules made up of these substrates. With the daily usage of smart card, it faces different kind of physical and mechanical load, which will affect the functional purpose. Hence, by using various techniques to characterize the different composite substrate properties, the quality of product to serve its functionality is identified. The thermal properties of the substrates were also characterized using Thermogravimetric Analysis (TGA) and Dynamic Mechanical Analysis (DMA). Optical Microscope and Scanning Electron Microscope (SEM) were used to observe the damage after each mechanical testing. The results were analyzed and compared among different grades of substrates. The differences in resins and fiber volume fraction presented in the substrate give different mechanical behaviour. The substrate with a high fiber volume fraction shows complete failure during 2-point bending test. Moreover, the cladded copper layer on the substrate causes a decrease in tensile strength and an increase in bending load. Overall, the substrates with epoxy resin as matrix exhibit better thermal and mechanical properties.