A mechanical study on particulate reinforced polyamides for electronic encapsulations

• Main Author: Affreen, Shahnas
• Other Authors: Gan Chee Lip
• Format: Final Year Project
• Language: English
• Published: 2017
• Subjects: DRNTU::Engineering::Materials
• Online Access: http://hdl.handle.net/10356/71673
• Institution: Nanyang Technological University

The use of engineering thermoplastics in the polymer industry today has grown in popularity and created higher demands for researchers and designers to come up with more cost efficient yet high-performance materials that can cater to a wide range of applications across several industries. Polyamide...