Thermal management solution for PCB using integrated heat pipes

• المؤلف الرئيسي: Koh, Cadance Jing Suan
• مؤلفون آخرون: Josep Pou
• التنسيق: Final Year Project
• اللغة: English
• منشور في: 2017
• الموضوعات: DRNTU::Engineering::Electrical and electronic engineering
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/71821
• المؤسسة: Nanyang Technological University

In almost all industrial electronic applications, the use of PCB is indispensable. Indubitably, it will introduce heat localisation and there has been many research done in the aspect of a finer thermal control management. It is not unfamiliar that a scaled-down cooling system is often in demand for...