Moldable and bendable dye sensitized solar cells

In this report, we explore the history of solar cells and the rise of dye-sensitized solar cells. (DSSC) We then look at the basic principles of the PV cell and how we quantify the quality of the PV cell now. Next, we discussed about the DSSC, its individual components and the state of the art of e...

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Bibliographic Details
Main Author: Ng, Zhi Kai
Other Authors: Teo Hang Tong Edwin
Format: Final Year Project
Language:English
Published: 2017
Subjects:
Online Access:http://hdl.handle.net/10356/72019
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Institution: Nanyang Technological University
Language: English
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Summary:In this report, we explore the history of solar cells and the rise of dye-sensitized solar cells. (DSSC) We then look at the basic principles of the PV cell and how we quantify the quality of the PV cell now. Next, we discussed about the DSSC, its individual components and the state of the art of each of these components. We then discussed the material of graphene foam, a.k.a 3D-C, and its potential in DSSCs. This is followed by a literature review of DSSCs and identifying the project scope and outcome of the project, which we have identified as using 3D-C to make the photoanodes of the PV cell bendable and metal-free. We proceeded with studying the composition, morphology, electronic structure, bonding analysis and absorption kinetics of the modified 3D-C photoanode with dye sensitizer, a.k.a. o-3D-C/dye. We used many different techniques, including Raman spectroscopy, Raman Scattering spectroscopy, AFM, KFPM, XPS, STM and STS to quantify the o-3D-C/dye photoanode and its effectiveness. As the results turn out, we achieved increased dye loading and shorter dye loading times, while at the same type substituting the TiO2 layer for a cheaper material of functionalized 3D-C surfaces. The Raman spectroscopy supports our thesis that the dye forms a strong bond with functionalized surface, resulting in a more stable and denser adhesion of dye molecules. Further work could be done on understanding the charge transfer mechanics of the 3D-C/dye interface, amongst other suggest future areas of interest.