Design of wire bond inductors and high-speed printed circuit board

• Main Author: Mohamed Mansoor Mohamed Mafraz
• Other Authors: AChang, Joseph Sylvester
• Format: Theses and Dissertations
• Language: English
• Published: 2017
• Subjects: DRNTU::Engineering::Electrical and electronic engineering
• Online Access: http://hdl.handle.net/10356/72585
• Institution: Nanyang Technological University

Wire bond technology is a matured and dominant interconnect methodology compared to other chip interconnect methodologies. The parasitic components of the bond wire, especially in high speed operating conditions, have to be modeled accurately before utilizing the bond wire in such designs. Our rese...