Design of wire bond inductors and high-speed printed circuit board

• المؤلف الرئيسي: Mohamed Mansoor Mohamed Mafraz
• مؤلفون آخرون: AChang, Joseph Sylvester
• التنسيق: Theses and Dissertations
• اللغة: English
• منشور في: 2017
• الموضوعات: DRNTU::Engineering::Electrical and electronic engineering
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/72585
• المؤسسة: Nanyang Technological University

Wire bond technology is a matured and dominant interconnect methodology compared to other chip interconnect methodologies. The parasitic components of the bond wire, especially in high speed operating conditions, have to be modeled accurately before utilizing the bond wire in such designs. Our rese...