Design of wire bond inductors and high-speed printed circuit board
Wire bond technology is a matured and dominant interconnect methodology compared to other chip interconnect methodologies. The parasitic components of the bond wire, especially in high speed operating conditions, have to be modeled accurately before utilizing the bond wire in such designs. Our rese...
Saved in:
| 主要作者: | |
|---|---|
| 其他作者: | |
| 格式: | Theses and Dissertations |
| 語言: | English |
| 出版: |
2017
|
| 主題: | |
| 在線閱讀: | http://hdl.handle.net/10356/72585 |
| 標簽: |
添加標簽
沒有標簽, 成為第一個標記此記錄!
|
| 機構: | Nanyang Technological University |
| 語言: | English |