Mitigation of noise propagation on power and ground layers with electromagnetic band-gap (EBG) structure

• Main Author: Yao, Shu
• Other Authors: See Kye Yak
• Format: Theses and Dissertations
• Language: English
• Published: 2018
• Subjects: DRNTU::Engineering::Electrical and electronic engineering
• Online Access: http://hdl.handle.net/10356/73105
• Institution: Nanyang Technological University

In this dissertation, several cases are investigated to explore methods of mitigation of the noise propagation within the metal layers of a printed circuit board (PCB) using an Electromagnetic Band-Gap (EBG) structure. The Computer Simulation Technology (CST) Microwave Studio simulation software is used to design, construct, simulate and analyze different configurations of the EBG structure on the PCB. All the simulations are performed in the frequency-domain and the analysis is based on the Sparameter results obtained from the simulation. These different configurations are compared with each other through the analysis of the S-parameter results, in terms of their capability and performance of the noise suppression. These results can be applied to the fabrication of PCBs for the fulfillment of high-speed power integrity performance. Finally, several recommendations are made to further improve the study of the implementation of the EBG structure.