Early product learning (EPL) and failure analysis flow and strategy

The Early Product Learning (EPL) project was started to improve yield and efficiency of ICs and minimize customer return spills. There are four main phases of every IC failure analysis project. The first phase is non-destructive testing, where tools like acoustic microscopy and x-ray imaging are app...

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Main Author: Veeraraghavan Anurathi
Other Authors: Zhou Xing
Format: Theses and Dissertations
Language:English
Published: 2018
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Online Access:http://hdl.handle.net/10356/73113
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-731132023-07-04T15:38:27Z Early product learning (EPL) and failure analysis flow and strategy Veeraraghavan Anurathi Zhou Xing School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering The Early Product Learning (EPL) project was started to improve yield and efficiency of ICs and minimize customer return spills. There are four main phases of every IC failure analysis project. The first phase is non-destructive testing, where tools like acoustic microscopy and x-ray imaging are applied to learn as much about the sample without permanently altering it in any way. Next comes fault verification, where the analyst attempts to replicate the failing conditions reported by the customer. Without confirming the failure, the project cannot continue, since there is no evidence to show that a defect even exists. With the fault confirmed, the next phase is fault isolation, where the analyst identifies a site for an in-depth destructive physical analysis and examination. Finally, destructive analysis and documentation serve as the culmination of all the data collection from which an analyst will perform deprocessing, a cross-section, or other destructive technique to reveal the defect in its entirety and identify its most likely cause. Various advanced semiconductor failure analysis techniques were used, including Scanning Electron Microscopy (SEM), Energy-Dispersive X-ray spectroscopy (EDX), Curve Tracer, Scanning Acoustic Topography (SAT) and X-ray inspection among others to isolate the root cause of electrical failure in multiple types of devices based on varied process technologies. Failure Analysis flow and strategy: The failure analysis team had managed to create a FA flow and strategy iCommunity page where people could share their analysis examples, summarize helpful hints related to the analysis, point out common pitfalls and collect their inputs from. This would ultimately result in the transparency of the analysis flow and improve their flexibility. Its helps connect analysts from all over the world which leads to an effective knowledge sharing association. Master of Science (Green Electronics) 2018-01-03T06:16:12Z 2018-01-03T06:16:12Z 2018 Thesis http://hdl.handle.net/10356/73113 en 68 p. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic DRNTU::Engineering::Electrical and electronic engineering
spellingShingle DRNTU::Engineering::Electrical and electronic engineering
Veeraraghavan Anurathi
Early product learning (EPL) and failure analysis flow and strategy
description The Early Product Learning (EPL) project was started to improve yield and efficiency of ICs and minimize customer return spills. There are four main phases of every IC failure analysis project. The first phase is non-destructive testing, where tools like acoustic microscopy and x-ray imaging are applied to learn as much about the sample without permanently altering it in any way. Next comes fault verification, where the analyst attempts to replicate the failing conditions reported by the customer. Without confirming the failure, the project cannot continue, since there is no evidence to show that a defect even exists. With the fault confirmed, the next phase is fault isolation, where the analyst identifies a site for an in-depth destructive physical analysis and examination. Finally, destructive analysis and documentation serve as the culmination of all the data collection from which an analyst will perform deprocessing, a cross-section, or other destructive technique to reveal the defect in its entirety and identify its most likely cause. Various advanced semiconductor failure analysis techniques were used, including Scanning Electron Microscopy (SEM), Energy-Dispersive X-ray spectroscopy (EDX), Curve Tracer, Scanning Acoustic Topography (SAT) and X-ray inspection among others to isolate the root cause of electrical failure in multiple types of devices based on varied process technologies. Failure Analysis flow and strategy: The failure analysis team had managed to create a FA flow and strategy iCommunity page where people could share their analysis examples, summarize helpful hints related to the analysis, point out common pitfalls and collect their inputs from. This would ultimately result in the transparency of the analysis flow and improve their flexibility. Its helps connect analysts from all over the world which leads to an effective knowledge sharing association.
author2 Zhou Xing
author_facet Zhou Xing
Veeraraghavan Anurathi
format Theses and Dissertations
author Veeraraghavan Anurathi
author_sort Veeraraghavan Anurathi
title Early product learning (EPL) and failure analysis flow and strategy
title_short Early product learning (EPL) and failure analysis flow and strategy
title_full Early product learning (EPL) and failure analysis flow and strategy
title_fullStr Early product learning (EPL) and failure analysis flow and strategy
title_full_unstemmed Early product learning (EPL) and failure analysis flow and strategy
title_sort early product learning (epl) and failure analysis flow and strategy
publishDate 2018
url http://hdl.handle.net/10356/73113
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